About UsTMRW SILICON is an early-stage technology company integrating the entire value chain of nanophotonics-enhanced CMOS sensors, from silicon design to final applications, including sensor characterization, data acquisition electronics, and firmware development.

By controlling every stage of the process, we can optimize the sensor itself for each specific application, rather than adapting the application to commercially available sensors.

Our target applications include innovative solutions based on biomedical signals, as well as industrial and scientific imaging in the Near-Infrared (NIR) and Short-Wave Infrared (SWIR) ranges.

The purpose of this role is to become the hardware design reference across this entire value chain, developing the electronics that support each new sensor, from characterization boards and evaluation kits to application-specific devices.

The successful candidate will work closely with our IC design, sensor characterization, and firmware teams, contributing to the definition of hardware requirements for future generations of devices.

What You Will DoYou will provide technical leadership to our multidisciplinary hardware team (PCB layout, analog/RF, firmware, and prototyping) and act as the team's main PCB design authority. You will define what needs to be done, establish priorities, ensure design quality, and take direct ownership of schematic design and PCB layout whenever project requirements call for it.

- Provide technical leadership to the multidisciplinary hardware team: Plan and prioritize activities across projects and internal stakeholders (IC design, characterization, and product development), allocate resources, review team designs, and take responsibility for their technical quality and delivery deadlines.
- Design schematics and multilayer PCB layouts for high-density, mixed-signal sensor characterization boards, evaluation kits, and demonstrators.
- Take ownership of design releases, including design reviews, Design for Manufacturing (DFM) assessments, release checklists,



and direct coordination with PCB fabrication and assembly manufacturers.
- Contribute to the entire product development lifecycle, from concept to validation, including defining requirements and electrical interfaces in collaboration with IC design and test laboratory teams, conducting design reviews, and addressing packaging and assembly considerations.
- Build and maintain reusable libraries, templates, and design rules, making effective use of design reuse, assisted design review, and automated documentation capabilities within the EDA workflow.

What We Are Looking For
- 7+ years of experience in electronic hardware design, including high-density, multilayer, mixed-signal PCB layouts released for manufacturing.
- Strong knowledge of Design for Manufacturing (DFM) principles and IPC standards, particularly IPC-2221 and IPC-7351, including Class 2 and Class 3 requirements.
- Experience with designs requiring careful Signal Integrity (SI) and Power Integrity (PI) considerations, including high-speed interfaces, critical power distribution, and controlled PCB stack-ups.
- Practical experience using LTspice or equivalent SPICE simulation tools as part of the regular design process, particularly for analog front-ends, filters, and low-noise power supplies.
- Proven experience providing technical leadership to a hardware team of at least 3 people across multiple concurrent projects, including planning, prioritization, design reviews, and coordination with PCB manufacturers and Electronic Manufacturing Services (EMS) providers.
- A hands-on engineering mindset, with the ability to personally take ownership of schematic design and PCB layout whenever required.
- Proficiency in Altium Designer and/or KiCad.




- Spanish and technical English proficiency.

Nice to Have
- Experience working in a fabless semiconductor company, sensor or ASIC design center, or hardware R&D; team developing electronics for its own silicon, including integrated circuit test and characterization boards, evaluation kits, and reference designs.
- Experience with Siemens Xpedition; knowledge of PADS or Cadence Allegro is also valuable.
- Experience performing pre-layout and post-layout Signal Integrity (SI) and Power Integrity (PI) analysis using HyperLynx or equivalent tools, as well as working with IBIS models.
- IPC CID or CID+ certification.
- Experience with image sensors, optoelectronic devices, FPGAs, or electronic instrumentation.
- Previous experience working under ISO 9001 quality management systems or in regulated industries such as medical devices, aerospace, or automotive.

What We OfferThe opportunity to work with cutting-edge technology, applied to image sensors, with the potential to enable a new generation of devices for healthcare, industry, and scientific applications. And, more importantly, the opportunity to be part of this innovation from the inside, your hardware will be the first interface to every new chip we develop and a fundamental part of turning that technology into a real-world product.

You will benefit from

- End-to-end product development: Work on a complete in-house technology platform, spanning chip design, electronics, firmware, and final applications.
- Technical autonomy and influence: Join an agile, experienced team where your engineering judgment and technical decisions genuinely matter.
- Advanced engineering tools: Work with AI-powered tools integrated into the hardware design workflow.
- Professional development: Expand your expertise in industry standards and IPC certifications.
- Technical ownership from day one: Take responsibility for the hardware platform, with direct access to company management and the opportunity to shape its technical direction.

📌 Head of hardware – CMOS Sensor Electronics (España)
🏢 TMRW SILICON
📍 España