08 nov
|
Semidynamics
|
Cataluña
08 nov
Semidynamics
Cataluña
You will own the thermal path from die junction to facility water — on-die hotspots, package spreading, cold plate design, sled airflow and rack-level heat rejection. Senior IC role: you set the thermal budget the rest of the hardware team designs against. What you will work on:
* Thermal solution for a multi-die AI accelerator at high TDP
* Liquid cooling: cold plate, manifold, loop design and facility interface
* Die-level hotspot and transient thermal analysis using power maps
* Sled, shelf and rack thermal architecture, including hybrid air and liquid
* Thermal telemetry, throttling policy and thermal-aware power management
Responsibilities:
1. Analysis & modelling: Build detailed and compact thermal models of die, package and board. Run CFD and conjugate heat
📌 Senior Thermal Engineer (Cataluña)
🏢 Semidynamics
📍 Cataluña