Junior Photonic Packaging Engineer (España)

Junior Photonic Packaging Engineer (España)

05 nov
|
BIST People Working Group
|
España

05 nov

BIST People Working Group

España

ICFO is seeking a Junior Process Engineer in PIC Packaging to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs). The selected candidate will work in an advanced R&D; pilot-line environment, developing processes and solving engineering challenges. You will collaborate with multidisciplinary teams to implement scalable packaging solutions and advance PIC technologies from design to testing and applications. #J-18808-Ljbffr

📌 Junior Photonic Packaging Engineer (España)
🏢 BIST People Working Group
📍 España

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