Open role Senior Bonding & Assembly Engineer
When it is, the ability to compute, and to manufacture the hardware that computes, should not be concentrated in a few places. Touchdown's mission is to make compute accessible to the whole world and to reindustrialize advanced semiconductor manufacturing in the United States. We co-design everything for next-generation compute: the AI systems people use, the software that serves them, the architectures and chips underneath, and the packaging, test, and manufacturing that make them real. We build alongside the world's best manufacturing ecosystems, including Taiwan's, and every role here makes one layer better and carries what it learns to the rest.
Thermocompression, hybrid, and flip-chip bonding; Take ownership of bonding and assembly work on active programs.
Bonding and assembly process windows.
8+ years in a high-volume fab, foundry,



or advanced-packaging environment.
~ Thermocompression, hybrid, or flip-chip bonding experience.
~ Has set inspection and rework criteria from reliability data.
Mandarin
You use coding agents, AI-assisted analysis, and automation every day, and you check their output against measurements before anyone relies on it.
We work alongside foundries, test houses, OSATs, and research labs, and we build with partners rather than against them.
Touchdown does not operate a production fab today.
Full-time.
Taiwan roles are employed through a local employer of record. Mandarin is a strong plus for Taiwan roles; English is required for written work.

📌 Senior Bonding & Assembly Engineer (Montroy)
🏢 Touchdown Labs
📍 Montroy