ICFO invites applications for a postdoctoral researcher position within the PICs@ICFO Strategic Initiative focused on Through-Glass Vias metallization and seed-layer processes. The successful candidate will develop and optimize seed layers and deposition methods for high-aspect-ratio vias in glass to enable copper interconnects.The role emphasizes hands-on thin-film deposition, surface activation, adhesion promotion, and integration with subsequent plating steps, in collaboration with the#J-18808-Ljbffr
📌 Postdoc: Tgv Metallization & Seed-Layer Expert (Madrid)
🏢 Institute Of Photonic Sciences
📍 Madrid
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