Senior Bonding & Assembly Engineer — Precision Chip Bonding (Madrid)

Senior Bonding & Assembly Engineer — Precision Chip Bonding (Madrid)

28 oct
|
Touchdown Labs
|
Madrid

28 oct

Touchdown Labs

Madrid

Touchdown Labs in Taiwan is seeking a Senior Bonding & Assembly Engineer to lead the bonding and assembly work on active programs. You will set inspection criteria for voids, alignment, and warpage, and own bonder qualification with specialized equipment.You bring 8+ years in high-volume fab or advanced-packaging, hands-on with thermocompression, hybrid, or flip-chip bonding, and experience defining reliable rework criteria from data. Mandarin is a plus.#J-18808-Ljbffr

📌 Senior Bonding & Assembly Engineer — Precision Chip Bonding (Madrid)
🏢 Touchdown Labs
📍 Madrid

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