You will own the power distribution network from voltage regulator output to die bump — impedance, IR drop, droop and decoupling across package and board. Senior IC role: you own the PDN numbers that power delivery, SI and the package team design against. DC IR, AC impedance, transient droop and electro-thermal analysis across die, package and board PDN noise to jitter translation, closed back into the SI budget Analysis & closure: Build and close DC IR, electro-thermal, AC impedance and transient PDN analysis from VR output through package to die bump. Translate PDN noise into jitter through PHY supply sensitivity, and feed the result back into the channel budget. 8+ years in power integrity for high-speed digital systems, including package-level PDN work ~ Python scripting for automation and post-processing 4 days per week in the Barcelona office (city center), 1 day WFH. ~
📌 Senior Power Integrity Engineer (España)
🏢 Semidynamics
📍 España
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