24 oct
|
Semidynamics
|
Barcelona
24 oct
Semidynamics
Barcelona
You will own the thermal path from die junction to facility water — on-die hotspots, package spreading, cold plate design, sled airflow and rack-level heat rejection. Senior IC role: you set the thermal budget the rest of the hardware team designs against.
What you will work on:
Thermal solution for a multi-die AI accelerator at high TDP
Liquid cooling: cold plate, manifold, loop design and facility interface
Die-level hotspot and transient thermal analysis using power maps
Sled, shelf and rack thermal architecture, including hybrid air and liquid
Thermal telemetry, throttling policy and thermal-aware power management
Responsibilities:
Analysis & modelling: Build detailed and compact thermal models of die, package and board. Run CFD and conjugate heat
📌 Thermal Engineer (Barcelona)
🏢 Semidynamics
📍 Barcelona