Job Description
Our partner is looking for a Senior Thermal Engineer to own the thermal architecture for advanced compute hardware, from die and package level analysis through liquid cooling, sled design and rack level heat rejection. This is a senior individual contributor role with strong technical ownership. You will define thermal budgets, cooling requirements and validation methods, working closely with mechanical, power and hardware teams.

Location:
Barcelona, Spain, Hybrid Level: Senior Responsibilities
* Own thermal design from silicon to rack level
* Define thermal budgets for high power compute hardware
* Model die hotspots, package spreading and board level thermal behaviour
* Run CFD and conjugate heat transfer simulations
* Perform transient analysis using realistic workload power profiles
* Design cold plates, manifolds and liquid cooling loops
* Define flow rate, pressure drop and coolant requirements
* Specify TIM stack, bond line and thermal interface requirements
* Define sled and rack thermal architecture
* Set coolant distribution, redundancy and failure response requirements
* Own thermal validation on real hardware
* Correlate simulation results with sensor and test measurements
* Work with mechanical, power and cooling partners
* Support thermal telemetry, throttling and power management decisions Requirements




* 8+ years of electronics thermal engineering experience
* Background in high power computing, data centres or similar electronics
* Thermal ownership of processors, GPUs, ASICs or FPGAs
* Strong package level thermal analysis
* Strong CFD and thermal simulation experience
* Icepak, Flotherm, Star CCM+ or equivalent
* Liquid cooling and cold plate design
* Flow and pressure budget experience
* TIM selection and bond line knowledge
* Thermal interface reliability understanding
* Practical thermal validation experience
* Strong simulation to measurement correlation skills Optional / Desired
* 2.5D, interposer or chiplet thermal design
* Two phase cooling
* Immersion cooling
* Direct to chip cooling
* OCP rack cooling experience
* Facility water interface design
* Electro thermal simulation
* Power delivery or PDN collaboration
* Python for automation and test analysis What's in it for you?
* Adaptable

working hours
* Hybrid model, 4 days office, 1 day from home
* 1 week per year working from anywhere
* 25 days annual leave plus December 24 and 31
* Monthly food allowance
* Private medical insurance
* Relocation bonus
* Housing search support
* Visa support if required
* Family relocation support
* Virtual shares
* Language classes
* Tax incentive, subject to eligibility

📌 Senior Thermal Engineer (Barcelona)
🏢 Hireroo
📍 Barcelona