Open role

Senior Bonding & Assembly Engineer

Our mission

AI is becoming fundamental to how the world works. When it is, the ability to compute, and to manufacture the hardware that computes, should not be concentrated in a few places. Touchdown's mission is to make compute accessible to the whole world and to reindustrialize advanced semiconductor manufacturing in the United States.

We co-design everything for next-generation compute: the AI systems people use, the software that serves them, the architectures and chips underneath, and the packaging, test, and manufacturing that make them real. Co-design brings down the complexity and cost of building compute. That is what makes manufacturing in America competitive again, and what puts compute within reach of people and companies everywhere.

We build alongside the world's best manufacturing ecosystems, including Taiwan's, and every role here makes one layer better and carries what it learns to the rest.

Why this role matters

Fine-pitch bonding determines how densely chips can be connected and how reliably. Getting joins right is central to building co-designed multi-die systems.

Technical scope

Thermocompression, hybrid, and flip-chip bonding; alignment and placement accuracy; surface preparation for bonding; void, alignment, and warpage inspection; bond reliability under thermal and mechanical stress; rework and scrap criteria; bonder qualification.

First 90 days

- Take ownership of bonding and assembly work on active programs.
- Set inspection criteria for voids, alignment,



and warpage.
- Write rework and scrap rules.

What you will own
- Bonding and assembly process windows.
- Inspection with metrology.
- Bonder qualification with equipment.

What you bring
- 8+ years in a high-volume fab, foundry, or advanced-packaging environment.
- Thermocompression, hybrid, or flip-chip bonding experience.
- Hands-on with bonders and placement tools at fine pitch.
- Has set inspection and rework criteria from reliability data.

Helpful experience
- Mandarin

How we work
- AI-native by default. You use coding agents, AI-assisted analysis, and automation every day, and you check their output against measurements before anyone relies on it.
- We work alongside foundries, test houses, OSATs, and research labs, and we build with partners rather than against them.
- Touchdown does not operate a production fab today.
- Do not bring, send, or use confidential information or trade secrets from a current or former employer. We hire for skill and judgment, not for anyone else's process recipes.

How the role works
- Full-time.
- Location: Hsinchu, Taiwan.
- Openings: Multiple.
- Taiwan roles are employed through a local employer of record. Mandarin is a strong plus for Taiwan roles; English is required for written work.
- Start date and employment details are discussed during the process.

Apply for this role → Applications are reviewed against the work described here. We do not use a degree, title, or keyword list as a substitute for evidence.

📌 Senior Bonding & Assembly Engineer (España)
🏢 Touchdown Labs
📍 España