19 oct
|
BIST People Working Group
|
Altafulla
19 oct
BIST People Working Group
Altafulla
ICFO is seeking a Junior Process Engineer in PIC Packaging to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs).La siguiente información tiene como objetivo proporcionar a los posibles candidatos una mejor comprensión de los requisitos para este puesto.The selected candidate will work in an advanced R&D; pilot-line environment, developing processes and solving engineering challenges. xhfqzwm You will collaborate with multidisciplinary teams to implement scalable packaging solutions and advance PIC technologies from design to testing and applications.#J-18808-Ljbffr
📌 Junior Photonic Packaging Engineer (Altafulla)
🏢 BIST People Working Group
📍 Altafulla