Hrer2026/393 Engineer For Advanced Packaging Of Gan-Based Hemts (Madrid)

Hrer2026/393 Engineer For Advanced Packaging Of Gan-Based Hemts (Madrid)

18 oct
|
Universidad Politécnica de Madrid
|
Madrid

18 oct

Universidad Politécnica de Madrid

Madrid

Organisation/Company UNIVERSIDAD POLITECNICA DE MADRID Department HRS4R Research Field Engineering » Electronic engineering Researcher Profile First Stage Researcher (R1) Positions Bachelor Positions Application Deadline 8 Oct 2026 - 23:00 (Europe/Madrid) Country Spain Type of Contract Temporary Job Status Full-time Hours Per Week 37,5 Offer Starting Date 28 Sep 2026 Is the job funded through the EU Research Framework Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? NoOffer DescriptionDesign, fabrication and characterization of packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs:Study and development of various packaging architectures (wirebonding and embedded chip) for high frequency and high power operationCharacterization of thermal dissipation and RF signal integrity in standalone and packaged devices by optical spectroscopy (Raman, IR) and RF measurementsRequirementsResearch Field Engineering Education Level Bachelor Degree or equivalentResearch Field Physics Education Level Bachelor Degree or equivalentSkills/QualificationsMS Office, Latex, Adobe Illustrator, AutoCADPrevious experience on programming (Python, C, LabVIEW, etc) and scientific (Mathematica, Matlab, Origin, etc) or simulation (COMSOL, etc)



software will be highly valuedSpecific RequirementsCandidates must hold a Bachelor Degree in Electronic/Telecommunication/Materials Engineering or PhysicsProficiency in EnglishGoal-oriented mindset, creativity, teamwork & communication skillsPrevious research experience will be highly valued, specially that related to cleanroom processing and electrical and optical characterizationLanguages ENGLISH Level GoodResearch Field Engineering » Electronic engineeringEngineering » Materials engineeringTechnology » Nanotechnology Years of Research Experience 1 - 4Additional InformationThe hired engineer will work in a joint program with INDRA Sistemas S. A., a Spanish multinational company, within the project “Chair UPM-INDRA in Microelectronics”.Health and social benefits according to Spanish law.*The contracted researcher will participate in a joint program with INDRA, an international Spanish-based company, within the project “Chair UPM-INDRA in microelectronics”.TSI-(phone hidden)-0016Work Location(s)Number of offers available 1 Company/Institute Instituto de Sistemas Optoelectrónicos y Microtecnología (ISOM) & Centro de Materiales y Dispositivos Avanzados para Tecnologías de Información y Comunicaciones (CEMDATIC) Country Spain State/Province MADRID City MADRID Postal Code 28040 Street Avenida Complutense, 30 Geofield#J-18808-Ljbffr

📌 Hrer2026/393 Engineer For Advanced Packaging Of Gan-Based Hemts (Madrid)
🏢 Universidad Politécnica de Madrid
📍 Madrid

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