PICs@ICFO Strategic Initiative: Postdoctoral Researcher in TGV Metallization and Seed-Layer Processes As part of the PICs@ICFO Strategic Initiative, ICFO coordinates PIXEurope, a flagship Pilot Line funded under the European Chips JU program, focused on Advanced Photonic Integrated Circuits (PICs) through which ICFO is advancing frontier technologies, including optical interposers for Co-packaged optics for next-generation optoelectronic and photonic devices. To strengthen this initiative, ICFO is seeking a highly motivated Engineer/Scientist with strong expertise in thin-film deposition and metallization of high-aspect-ratio Through-Glass Vias (TGVs). Position Overview:, We offer a post-doctoral position to a scientist with hands-on experience in thin-film deposition, surface preparation, and metallization for semiconductor, MEMS, or advanced-packaging applications. The successful candidate will develop, optimize, and scale reliable adhesion, barrier, and conductive seed layers inside high-aspect-ratio glass vias,



ensuring continuity and compatibility with subsequent copper plating and interconnection processes. Key Responsibilities:, The selected candidate will be expected to: * Develop and optimize seed-layer deposition processes for high-aspect-ratio Through-Glass Vias * Develop substrate cleaning, glass-surface activation, and adhesion-promotion processes * Develop adhesion, barrier, and conductive seed stacks such as Ti/Cu, Cr/Cu, TiW/Cu, and related systems * Optimize sputtering, evaporation, electroless, ALD or CVD-assisted, and hybrid deposition approaches * Achieve continuous and conformal seed coverage along via entrances, sidewalls, and exits * Characterize thickness, morphology, resistivity, adhesion, continuity, and wafer-level uniformity * Identify and mitigate shadowing, seed discontinuity, oxidation, delamination, and cracking * Coordinate with the laser and glass team to align via geometry and surface condition with seeding, plating, and interconne

📌 PICs@ICFO Strategic Initiative: Postdoctoral Researcher in TGV Metallization and Seed-Layer Processes (España)
🏢 Institute Of Photonic Sciences
📍 España