H/393 Engineer for Advanced packaging of GaN-based HEMTs (España)

H/393 Engineer for Advanced packaging of GaN-based HEMTs (España)

17 oct
|
Universidad Politécnica de Madrid
|
España

17 oct

Universidad Politécnica de Madrid

España

Organisation/Company UNIVERSIDAD POLITECNICA DE MADRID Department HRS4R Research Field Engineering » Electronic engineering Researcher Profile First Stage Researcher (R1) Positions Bachelor Positions Application Deadline 8 Oct 2026 - 23:00 (Europe/Madrid) Country Spain Type of Contract Temporary Job Status Full-time Hours Per Week 37,5 Offer Starting Date 28 Sep 2026 Is the job funded through the EU Research Framework Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Design, fabrication and characterization of packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: * Study and development of various packaging architectures (wirebonding and embedded chip) for high frequency and high power operation * Characterization of thermal dissipation and RF signal integrity in standalone and packaged devices by optical spectroscopy (Raman, IR)



and RF measurements Requirements Research Field Engineering Education Level Bachelor Degree or equivalent Research Field Physics Education Level Bachelor Degree or equivalent Skills/Qualifications * MS Office, Latex, Adobe Illustrator, AutoCAD * Previous experience on programming (Python, C, LabVIEW, etc) and scientific (Mathematica, Matlab, Origin, etc) or simulation (COMSOL, etc) software will be highly valued Specific Requirements * Candidates must hold a Bachelor Degree in Electronic/Telecommunication/Materials Engineering or Physics * Proficiency in English * Goal-oriented mindset, creativity, teamwork & communication skills * Previous research experience will be highly valued, specially that related to cleanroom processing and electrical and optical characterization Languages ENGLISH Level Good Research Field Engineering » Electronic engineeringEngineering » Materials engineeringTechnology » Nanotechnology Years of Research Experience 1 - 4 Additional Information * The hired engineer will work in a joint program with IND

📌 H/393 Engineer for Advanced packaging of GaN-based HEMTs (España)
🏢 Universidad Politécnica de Madrid
📍 España

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