15 oct
|
Hireroo
|
Madrid
Job Description
Our partner is looking for a
Senior Thermal Engineer
to own the thermal architecture for advanced compute hardware, from die and package level analysis through liquid cooling, sled design and rack level heat rejection.
This is a senior individual contributor role with strong technical ownership. You will define thermal budgets, cooling requirements and validation methods, working closely with mechanical, power and hardware teams.
Location:
Barcelona, Spain, Hybrid
Level:
Senior
Responsibilities
Own thermal design from silicon to rack level
Define thermal budgets for high power compute hardware
Model die hotspots, package spreading and board level thermal behaviour
Run CFD and conjugate heat transfer simulations
Perform transient analysis using realistic workload power profiles
Design cold plates, manifolds and liquid cooling loops
Define flow rate, pressure drop and coolant requirements
Specify TIM stack, bond line and thermal interface requirements
Define sled and rack thermal architecture
Set coolant distribution,
redundancy and failure response requirements
Own thermal validation on real hardware
Correlate simulation results with sensor and test measurements
Work with mechanical, power and cooling partners
Support thermal telemetry, throttling and power management decisions
Requirements
8+ years of electronics thermal engineering experience
Background in high power computing, data centres or similar electronics
Thermal ownership of processors, GPUs, ASICs or FPGAs
Strong package level thermal analysis
Strong CFD and thermal simulation experience
Icepak, Flotherm, Star CCM+ or equivalent
Liquid cooling and cold plate design
Flow and pressure budget experience
TIM selection and bond line knowledge
Thermal interface reliability understanding
Practical thermal validation experience
Strong simulation to measurement correlation skills
Optional / Desired
2.5D, interposer or chiplet thermal design
Two phase cooling
Im
📌 Senior Thermal Engineer (Madrid)
🏢 Hireroo
📍 Madrid