Job Description Our partner is looking for a

Senior Thermal Engineer

to own the thermal architecture for advanced compute hardware, from die and package level analysis through liquid cooling, sled design and rack level heat rejection.

This is a senior individual contributor role with strong technical ownership. You will define thermal budgets, cooling requirements and validation methods, working closely with mechanical, power and hardware teams.

Location:

Barcelona, Spain, Hybrid Level:

Senior

Responsibilities

Own thermal design from silicon to rack level

Define thermal budgets for high power compute hardware

Model die hotspots, package spreading and board level thermal behaviour

Run CFD and conjugate heat transfer simulations

Perform transient analysis using realistic workload power profiles

Design cold plates, manifolds and liquid cooling loops

Define flow rate, pressure drop and coolant requirements

Specify TIM stack, bond line and thermal interface requirements

Define sled and rack thermal architecture

Set coolant distribution, redundancy and failure response requirements

Own thermal validation on real hardware

Correlate simulation results with sensor and test measurements

Work with mechanical, power and cooling partners

Support thermal telemetry, throttling and power management decisions

Requirements





8+ years of electronics thermal engineering experience

Background in high power computing, data centres or similar electronics

Thermal ownership of processors, GPUs, ASICs or FPGAs

Strong package level thermal analysis

Strong CFD and thermal simulation experience

Icepak, Flotherm, Star CCM+ or equivalent

Liquid cooling and cold plate design

Flow and pressure budget experience

TIM selection and bond line knowledge

Thermal interface reliability understanding

Practical thermal validation experience

Strong simulation to measurement correlation skills

Optional / Desired

2.5D, interposer or chiplet thermal design

Two phase cooling

Immersion cooling

Direct to chip cooling

OCP rack cooling experience

Facility water interface design

Electro thermal simulation

Power delivery or PDN collaboration

Python for automation and test analysis

What’s in it for you?

Versátil working hours

Hybrid model, 4 days office, 1 day from home

1 week per year working from anywhere

25 days annual leave plus December 24 and 31

Monthly food allowance

Private medical insurance

Relocation bonus

Housing search support

Visa support if required

Family relocation support

Virtual shares

Language classes

Tax incentive, subject to eligibility

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📌 Senior Thermal Engineer (Madrid)
🏢 Hireroo
📍 Madrid