You will own the thermal path from die junction to facility water — on-die hotspots, package spreading, cold plate design, sled airflow and rack-level heat rejection. Senior IC role: you set the thermal budget the rest of the hardware team designs against. What you will work on: Thermal solution for a multi-die AI accelerator at high TDP Liquid cooling: cold plate, manifold, loop design and facility interface Die-level hotspot and transient thermal analysis using power maps Sled, shelf and rack thermal architecture, including hybrid air and liquid Thermal telemetry, throttling policy and thermal-aware power management Responsibilities: Analysis & modelling: Build detailed and compact thermal models of die, package and board. Run CFD and conjugate heat
📌 Senior thermal engineer (Barcelona)
🏢 Semidynamics
📍 Barcelona
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