Overview Director, Field Applications Engineering (UK/EU/APAC)

Role Overview

Lead and grow a world-class Field Applications Engineering (FAE) team across Europe and the Asia-Pacific region. You will drive the technical adoption, integration, and design-win pipeline for our next-generation fabric interconnect silicon IP. You will be responsible for both Pre AND Post sales support.

Role Details Position: Senior Manager, Field Applications Engineering Location: Remote (Based in the EU or the UK)

Region Coverage: UK, Europe (EU) and Asia-Pacific (APAC)

Travel: Up to 30-40% international travel required Key Responsibilities Manage: Lead a distributed team of senior FAEs across EU and APAC.

Hire: Recruit and onboard top-tier engineering talent in key regional hubs.

Coach: Provide continuous technical mentorship and professional development.

Align: Set clear regional goals aligned with corporate business objectives. Grow collaterals, to enable improved efficiency / ease of adoption by the customer Technical Account Management & Sales Support Drive Strategy: Partner with regional sales directors to secure high-value design wins.

Own Delivery: Act as the escalations point for critical customer technical issues.

Guide Evaluation: Oversee customer proof-of-concepts, evaluations, and architectural reviews.

Present: Deliver technical keynotes, deep-dives, and product demonstrations to C-level executives.

Feedback Loop: Funnel regional customer requirements directly to internal R&D; and Product Management.

Influence Roadmap:



Use market insights to shape the future fabric interconnect IP roadmap.

Enablement: Create application notes, whitepapers, and training collateral for regional ecosystems.

Required Qualifications

Experience & Education Education: Bachelor's degree in Electrical Engineering, Computer Engineering, or a related STEM field.

Management: 5+ years of experience managing customer-facing engineering teams (FAE or Technical Support).

Industry: 10+ years in the semiconductor, silicon IP, or high-performance networking sectors. Technical Expertise IP Knowledge: Deep understanding of Network-on-Chip (No C), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics.

Design Flow: Familiarity with front-end ASIC design, So C architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens).

Systems: Insight into AI/ML accelerators, data center architectures, and automotive So C requirements. Soft Skills & Logistics Communication: Exceptional English verbal and written communication skills.

Cross-Cultural: Proven experience managing teams and clients across diverse cultures in Europe and Asia.

Autonomy: Self-motivated style suited for a fast-paced, early-stage startup environment.

Preferred Qualifications

Master's degree or Ph D in Electrical or Computer Engineering. Prior experience working in a fast-growing, venture-backed silicon IP startup. Existing technical relationships with major Tier-1 semiconductor and system companies in the EU and APAC. Additional language skills relevant to the covered regions (e.g., Mandarin, Japanese, Korean, German).

📌 Director of field applications engineers; eu, uk, apac (Cantabria)
🏢 Baya Systems
📍 Cantabria