ICFO is seeking a Junior Process Engineer in PIC Packaging to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs).
The selected candidate will work in an advanced R&D; pilot-line environment, developing processes and solving engineering challenges.You will collaborate with multidisciplinary teams to implement scalable packaging solutions and advance PIC technologies from design to testing and applications.
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📌 Junior Photonic Packaging Engineer (España)
🏢 BIST People Working Group
📍 España
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