DESCRIPTIONAs part of the PICs@ICFO Strategic Initiative, ICFO is currently coordinating the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project, both major initiatives aimed at advancing Photonic Integrated Circuits (PICs) in Europe. These projects strengthen ICFO’s strategic positioning across the entire PIC development pipeline — from design and fabrication to packaging, testing, and real-world applications.Position OverviewWe are seeking a Junior Process Engineer in PIC Packaging, to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs). The selected candidate will play a key role in the experimental development of advanced PIC technologies within the PICs@ICFO Strategic Initiative.This is a highly hands‑on position in an advanced R&D pilot‑line environment, ideally suited for candidates who enjoy working with manufacturing equipment, developing processes, and solving practical engineering challenges.We welcome applications from motivated candidates eager to learn and grow in the field of photonics packaging.Key ResponsibilitiesDevelop and optimize die assembly and interconnection processes for electronic and photonic devices, including die attach, solder reflow, wire bonding, solder bumping and other related packaging processes.Set up, program, and operate semi‑automated equipment for process development and prototyping.Support the selection and qualification of materials, components, and suppliers to ensure process compatibility and quality.Optimize packaging processes through experimental evaluation, including thermo‑mechanical integrity and reliability testing (e.G., die shear, wire pull,



thermal cycling).Collaborate closely with multidisciplinary teams including optical, mechanical, RF, and test engineers to implement scalable and manufacturable packaging solutions.This position will report to the Prof. Dr. Valerio Pruneri, Scientific Coordinator of the PICs@ICFO Strategic Initiative encompassing the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project.REQUIREMENTS & CONDITIONSApplicants must hold FP Grado Superior, Bachelor’s, or Master’s Degree in Electronics, Microelectronics Engineering, Photonics, or a related field.Demonstrated experience working with precision equipment and instrumentation, in academics, R&D or industrial environment.Familiarity with semiconductor processes and environment is a plusThe idóneo candidate is pragmatic and detail‑oriented, collaborative and motivated to work in a multidisciplinary environment bridging research and industrial applications.What We OfferFull‑time contract for scientific and technical activities pursuant to Spanish Law 14/2011, linked to the Catalan PhotonChip project.Access to state‑of‑the‑art facilities for Photonic Packaging and Testing.Opportunity to develop hands‑on expertise in advanced packaging technologies at the interface between academia and industry.A family allowance may be granted to candidates with dependents, in accordance with ICFO policies.Equal OpportunityICFO is an equal opportunity employer. We hire based solely on merit and potential, regardless of gender, nationality, or disability. ICFO fully endorses the European Charter for Researchers and Code of Conduct for the Recruitment of Researchers, ensuring a transparent and supportive recruitment process.DEADLINE30th of October, 2026#J-18808-Ljbffr

📌 Pics@Icfo Strategic Initiative: Junior Process Engineer In Pic Packaging (Madrid)
🏢 BIST People Working Group
📍 Madrid