Job Description

Our partner is looking for a Senior Thermal Engineer to own the thermal architecture for advanced compute hardware, from die and package level analysis through liquid cooling, sled design and rack level heat rejection.

This is a senior individual contributor role with strong technical ownership. You will define thermal budgets, cooling requirements and validation methods, working closely with mechanical, power and hardware teams.

Location: Barcelona, Spain, Hybrid
Level: Senior

Responsibilities

- Own thermal design from silicon to rack level

- Define thermal budgets for high power compute hardware

- Model die hotspots, package spreading and board level thermal behaviour

- Run CFD and conjugate heat transfer simulations

- Perform transient analysis using realistic workload power profiles

- Design cold plates, manifolds and liquid cooling loops

- Define flow rate, pressure drop and coolant requirements

- Specify TIM stack, bond line and thermal interface requirements

- Define sled and rack thermal architecture

- Set coolant distribution, redundancy and failure response requirements

- Own thermal validation on real hardware

- Correlate simulation results with sensor and test measurements

- Work with mechanical, power and cooling partners

- Support thermal telemetry, throttling and power management decisions

Requirements




- 8+ years of electronics thermal engineering experience

- Background in high power computing, data centres or similar electronics

- Thermal ownership of processors, GPUs, ASICs or FPGAs

- Strong package level thermal analysis

- Strong CFD and thermal simulation experience

- Icepak, Flotherm, Star CCM+ or equivalent

- Liquid cooling and cold plate design

- Flow and pressure budget experience

- TIM selection and bond line knowledge

- Thermal interface reliability understanding

- Practical thermal validation experience

- Strong simulation to measurement correlation skills

Optional / Desired
- 2.5D, interposer or chiplet thermal design

- Two phase cooling

- Immersion cooling

- Direct to chip cooling

- OCP rack cooling experience

- Facility water interface design

- Electro thermal simulation

- Power delivery or PDN collaboration

- Python for automation and test analysis

What’s in it for you?
- Adaptable working hours

- Hybrid model, 4 days office, 1 day from home

- 1 week per year working from anywhere

- 25 days annual leave plus December 24 and 31

- Monthly food allowance

- Private medical insurance

- Relocation bonus

- Housing search support

- Visa support if required

- Family relocation support

- Virtual shares

- Language classes

- Tax incentive, subject to eligibility

📌 Senior Thermal Engineer (Barcelona)
🏢 Hireroo
📍 Barcelona