Job Description
Our partner is looking for a Senior Thermal Engineer to own the thermal architecture for advanced compute hardware, from die and package level analysis through liquid cooling, sled design and rack level heat rejection.
This is a senior individual contributor role with strong technical ownership. You will define thermal budgets, cooling requirements and validation methods, working closely with mechanical, power and hardware teams.
Location: Barcelona, Spain, Hybrid
Level: Senior
Responsibilities
- Own thermal design from silicon to rack level
- Define thermal budgets for high power compute hardware
- Model die hotspots, package spreading and board level thermal behaviour
- Run CFD and conjugate heat transfer simulations
- Perform transient analysis using realistic workload power profiles
- Design cold plates, manifolds and liquid cooling loops
- Define flow rate, pressure drop and coolant requirements
- Specify TIM stack, bond line and thermal interface requirements
- Define sled and rack thermal architecture
- Set coolant distribution,
redundancy and failure response requirements
- Own thermal validation on real hardware
- Correlate simulation results with sensor and test measurements
- Work with mechanical, power and cooling partners
- Support thermal telemetry, throttling and power management decisions
Requirements
- 8+ years of electronics thermal engineering experience
- Background in high power computing, data centres or similar electronics
- Thermal ownership of processors, GPUs, ASICs or FPGAs
- Strong package level thermal analysis
- Strong CFD and thermal simulation experience
- Icepak, Flotherm, Star CCM+ or equivalent
- Liquid cooling and cold plate design
- Flow and pressure budget experience
- TIM selection and bond line knowledge
- Thermal interface reliability understanding
- Practical thermal validation experience
- Strong simulation to measurement correlation skills