ICFO
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- The Institute of Photonic Sciences is seeking a Junior Process Engineer in PIC Packaging to advance assembly and interconnect technologies for Photonic Integrated Circuits (PICs).
The role involves hands-on work in an advanced R&D; pilot-line, developing processes and solving engineering challenges. xqbhyrx
The candidate will operate packaging equipment, participate in process development, and collaborate across multidisciplinary teams to deliver scalable solutions for PICs.
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📌 Junior Process Engineer, Photonic Packaging (España)
🏢 Icfo – The Institute Of Photonic Sciences
📍 España
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