Junior Process Engineer in PIC Packaging (Castelldefels)

Junior Process Engineer in PIC Packaging (Castelldefels)

02 oct
|
ICFO
|
Castelldefels

02 oct

ICFO

Castelldefels

As part of the
PICs@ICFO Strategic Initiative
, ICFO is currently coordinating the
European Chips JU Pilot Line PIXEurope
and the
Catalan PhotonChip
project, both major initiatives aimed at advancing Photonic Integrated Circuits (PICs) in Europe. These projects strengthen ICFO’s strategic positioning across the entire PIC development pipeline — from design and fabrication to packaging, testing, and real-world applications.

Position Overview

We are seeking a
Junior Process Engineer in PIC Packaging
, to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs). The selected candidate will play a key role in the experimental development of advanced PIC technologies within the PICs@ICFO Strategic Initiative.

This is a highly hands-on position in an advanced R&D; pilot-line environment, ideally suited for candidates who enjoy working with manufacturing equipment, developing processes, and solving practical engineering challenges.





We welcome applications from motivated candidates eager to learn and grow in the field of photonics packaging.

Key Responsibilities:

The successful candidate will be actively involved in operating and programming assembly equipment, developing manufacturing processes, and troubleshooting technical challenges in an advanced R&D; pilot-line environment. Specifically:
- Develop and optimize die assembly and interconnection processes for electronic and photonic devices, including die attach, solder reflow, wire bonding, solder bumping and other related packaging processes.
- Set up, program, and operate semi-automated equipment for process development and prototyping.
- Support the selection and qualification of materials, components, and suppliers to ensure process compatibility and quality.
- Optimize packaging processes through experimental evaluation, including thermo-mechanical integrity and reliability testing (e.g., die shear, wire pull, thermal cycling).
- Collaborate closely with multidis

📌 Junior Process Engineer in PIC Packaging (Castelldefels)
🏢 ICFO
📍 Castelldefels

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