Overview In this role you will lead the mechanical development of rugged electronic systems and act as the focal point for design decisions. You will manage a local engineering team and coordinate with international colleagues to ensure integrated, compliant solutions. You drive thermal, structural, and packaging design for VPX 3U systems in harsh environments. This position offers impact through shaping rugged hardware for mission-critical applications within a integral engineering ecosystem.
Compensaciones / Beneficioshybrid/remote workequal opportunity employer ResponsabilidadesLead and mentor a small local engineering team and prioritize tasksCoordinate with Thailand-based subsystem teams for seamless integrationManage System BOM, ensure traceability and accuracyTranslate customer requirements into mechanical constraints and tasksMaintain Requirements Compliance Matrix (VCRM)
aligned to MIL-STD-810Oversee rugged VPX 3U packaging design with IP65 sealingLead thermal design using conduction cooling and advanced heat transfer componentsDefine integration strategy for Backplane and IO Panel and cablingSupervise prototype assembly and verification plans per MIL-STD-810 / DO-160 Requisitos principalesBachelor's degree in Mechanical Engineering, Aerospace or related field5+ years in mechanical design for electronics packaging with team leadershipexpert SolidWorks and SolidWorks Simulation (thermal & structural)Experience with VPX-based systems and rugged environmentsFluent English for international collaborationleadershipstakeholder communicationcross-functional collaborationSolidWorksSolidWorks Simulationthermal management in sealed enclosures (conduction cooling)