18 sep
|
Teledyne Technologies
|
Sevilla
18 sep
Teledyne Technologies
Sevilla
Teledyne Technologies Incorporated is recruiting for a Package Design Engineer.
No deje pasar esta oportunidad, inscríbase rápidamente si su experiencia y habilidades coinciden con lo que se indica en la siguiente descripción.
The role can be based at our Seville site in Spain or at the Saint-Egrève site near Grenoble, France.
You will lead the complete design flow of advanced microelectronic packages and work closely with packaging vendors and assembly houses to ensure robust, reliable solutions.
You will monitor emerging xhfqzwm technologies, drive R&D; initiatives, and contribute to ongoing improvement of imaging packages in a integral,
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📌 Imaging Package Design Engineer – Microelectronics (Sevilla)
🏢 Teledyne Technologies
📍 Sevilla