Senior MEMS Advanced Packaging Engineer (Barcelona)

Senior MEMS Advanced Packaging Engineer (Barcelona)

16 sep
|
Inbrain Neuroelectronics
|
Barcelona

16 sep

Inbrain Neuroelectronics

Barcelona

Overview

Senior Test Systems Engineer at INBRAIN leads the industrialization and scaling of high‐throughput automated testing systems. You bridge R&D; and manufacturing, integrating mechanical, electronic and software subsystems to deliver turnkey production tools. You drive IQ/OQ/PQ validation, aging and reliability protocols, and data integration with MES. This role shapes how we translate advanced neurotechnology into reliable, scalable healthcare solutions.

Compensaciones / Ventajas private health insurance training bonus for professional development

23 vacation days per year

Christmas week off

Payflow & Flexflow remote-friendly? (office-based)

Responsabilidades System-Level Integration & Commissioning of test platforms from R&D; subsystems

Tech Transfer: handover to production, create SOPs and train technicians

Equipment Validation via IQ/OQ/PQ protocols to ensure production readiness

Scale Aging & Environmental Stress Testing for high-throughput manufacturing

Wafer-Level Test Industrialization: support probers, optimize die-level characterization

Data Pipeline & MES Integration:



connect hardware DAQs to MES and data warehouse

Requisitos principales Bachelors or Masters in Electrical Engineering, Mechatronics, Physics (or related)

5+ years in Test Development, Manufacturing Engineering or NPI

Experience building automated wafer probers or complex Hardware-in-the-Loop rigs

Scripting for hardware control (Python, C#) and instrument automation (SCPI/VISA)

Deep electrical characterization and signal integrity understanding

Hands-on debugging with oscilloscopes and SMUs for high-impedance/low-noise measurements

Proven ability to lead across matrixed R&D; teams and train operators

Ability to foresee usability risks on manufacturing floors and implement poka-yoke safeguards

Comfort in ambiguous, advanced R&D; environments cross-functional collaboration problem-solving under pressure communication and training abilities

Hardware-in-the-Loop (HIL) test rigs

SCPI/VISA communication

DAQ integration

📌 Senior MEMS Advanced Packaging Engineer (Barcelona)
🏢 Inbrain Neuroelectronics
📍 Barcelona

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