Teledyne Technologies Incorporated is recruiting for a Package Design Engineer. The role can be based at our Seville site in Spain or at the Saint-Egrève site near Grenoble, France. You will lead the complete design flow of advanced microelectronic packages and work closely with packaging vendors and assembly houses to ensure robust, reliable solutions. You will monitor emerging technologies, drive R&D; initiatives, and contribute to ongoing improvement of imaging packages in a integral,