Inbrain Neuroelectronics seeks a Senior MEMS Advanced Packaging Engineer to architect metrology, electrical test and data analysis infra. You will design automated test systems for 3D MEMS processes, drive DOE studies and translate findings into reliable production-ready tests.
Lead hardware characterization using SMUs, DAQs and probes, and collaborate with Process Integration, Packaging, Hardware and Software teams to scale from R&D; to production.
📌 Senior MEMS Packaging Engineer - Test & Automation (Madrid)
🏢 Inbrain Neuroelectronics
📍 Madrid
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