In this role you will lead the mechanical development of rugged electronic systems and act as the focal point for design decisions. You will manage a local engineering team and coordinate with international colleagues to ensure integrated, compliant solutions. You drive thermal, structural, and packaging design for VPX 3U systems in harsh environments. This position offers impact through shaping rugged hardware for mission-critical applications within a global engineering ecosystem.
Compensaciones / Incentivos
- hybrid/remote work
- equal opportunity employer
Responsabilidades
- Lead and mentor a small local engineering team and prioritize tasks
- Coordinate with Thailand-based subsystem teams for seamless integration
- Manage System BOM, ensure traceability and accuracy
- Translate customer requirements into mechanical constraints and tasks
- Maintain Requirements Compliance Matrix (VCRM) aligned to MIL-STD-810
- Oversee rugged VPX 3U packaging design with IP65 sealing
- Lead thermal design using conduction cooling and advanced heat transfer components
- Define integration strategy for Backplane and IO Panel and cabling
- Supervise prototype assembly and verification plans per MIL-STD-810 / DO-160
Requisitos principales
- Bachelor's degree in Mechanical Engineering, Aerospace or related field
- 5+ years in mechanical design for electronics packaging with team leadership
- expert SolidWorks and SolidWorks Simulation (thermal & structural)
- Experience with VPX-based systems and rugged environments
- Fluent English for international collaboration