Senior MEMS Advanced Packaging Engineer - INBRAIN Neuroelectronics (Barcelona)

Senior MEMS Advanced Packaging Engineer - INBRAIN Neuroelectronics (Barcelona)

14 sep
|
Inbrain Neuroelectronics
|
Barcelona

14 sep

Inbrain Neuroelectronics

Barcelona

Overview

Senior Test Systems Engineer at INBRAIN leads the industrialization and scaling of high‑throughput automated testing systems. You bridge R&D; and manufacturing, integrating mechanical, electronic and software subsystems to deliver turnkey production tools. You drive IQ/OQ/PQ validation, aging and reliability protocols, and data integration with MES. This role shapes how we translate advanced neurotechnology into reliable, scalable healthcare solutions.

Compensaciones / Incentivos

- private health insurance
- training bonus for professional development
- 23 vacation days per year
- Christmas week off
- Payflow & Flexflow
- remote-friendly? (office-based)

Responsabilidades

- System-Level Integration & Commissioning of test platforms from R&D; subsystems
- Tech Transfer: handover to production, create SOPs and train technicians
- Equipment Validation via IQ/OQ/PQ protocols to ensure production readiness
- Scale Aging & Environmental Stress Testing for high-throughput manufacturing
- Wafer-Level Test Industrialization: support probers, optimize die-level characterization
- Data Pipeline & MES Integration:



connect hardware DAQs to MES and data warehouse

Requisitos principales

- Bachelor's or Master's in Electrical Engineering, Mechatronics, Physics (or related)
- 5+ years in Test Development, Manufacturing Engineering or NPI
- Experience building automated wafer probers or complex Hardware-in-the-Loop rigs
- Scripting for hardware control (Python, C#) and instrument automation (SCPI/VISA)
- Deep electrical characterization and signal integrity understanding
- Hands-on debugging with oscilloscopes and SMUs for high-impedance/low-noise measurements
- Proven ability to lead across matrixed R&D; teams and train operators
- Ability to foresee usability risks on manufacturing floors and implement poka-yoke safeguards
- Comfort in ambiguous, advanced R&D; environments

- cross-functional collaboration
- problem-solving under pressure
- communication and training abilities
- Hardware-in-the-Loop (HIL) test rigs
- SCPI/VISA communication
- DAQ integration

📌 Senior MEMS Advanced Packaging Engineer - INBRAIN Neuroelectronics (Barcelona)
🏢 Inbrain Neuroelectronics
📍 Barcelona

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