Inbrain Neuroelectronics seeks a Senior MEMS Advanced Packaging Engineer to architect metrology, electrical test and data analysis infra.
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You will design automated test systems for 3D MEMS processes, drive DOE studies and translate findings into reliable production-ready tests. xqbhyrx
Lead hardware characterization using SMUs, DAQs and probes, and collaborate with Process Integration, Packaging, Hardware and Software teams to scale from R&D; to production.