Teledyne e2v Semiconductors SAS is recruiting a Package Design Engineer to drive the complete design flow for advanced microelectronic packages. Based near Grenoble or Seville, you will translate customer needs into technical specs and coordinate with vendors and assembly houses throughout the life cycle.You will conduct simulations, reviews, and DRC checks, and lead initiatives on imaging package technologies while maintaining strong interface with project teams and suppliers.#J-18808-Ljbffr