Inbrain Neuroelectronics in Bellaterra is seeking a Senior MEMS Advanced Packaging Engineer to architect metrology, electrical test and data analysis for 3D MEMS processes. You will lead test strategy, infrastructure setup and data-driven improvements across packaging, TGV/TWV interfaces and reliability.The role emphasizes Python-based data pipelines, cross-functional collaboration, and the industrialization of prototype test platforms for pilot and production, with a strong focus on test
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📌 Senior MEMS Packaging & Test Systems Architect (Barcelona)
🏢 Inbrain Neuroelectronics
📍 Barcelona
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