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Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.
We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.
Job Description
About us
You may not realize it, but Teledyne enables many of the products and services you use every day.
Teledyne e2v is recruiting a Package Design Engineer, this position can be based at our Saint‑Egrève site (near Grenoble, France) or at Teledyne Anafocus in Seville (Spain).
Teledyne e2v Semiconductors SAS,
based in Saint‑Egrève (near Grenoble), has been a recognized semiconductor specialist for more than 70 years. Our 400‑employee site brings together research and development teams, production workshops, and support functions for two main business areas:
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- Machine Vision Sensors (MVS) for image sensors, dental sensors, and cameras.
- High-Performance and High-Reliability semiconductor products: microprocessors, memories and high‑speed data converters.
Teledyne Anafocus, located in the Seville Tech Park, is a center of excellence in CMOS image sensor and vision‑on‑chip design, with a highly skilled engineering team and a strong innovation culture. Now fully integrated within Teledyne e2v, the site develops next‑generation imaging technologies for industrial, scientific, medical and surveillance applications.
Job description
The Package Design Engineer leads the complete design flow of advanced microelectronic pac