Our mission is to decode and modulate neural networks to improve people's livesAs a Senior Advanced Packaging Engineer, you will be the technical architect of metrology, electrical test and data analysis infrastructure. The primary goal is to invent, build and operate the automated test systems required to characterize complex vertical integration processes (advanced packaging, TGV, electromechanical reliability). You will be at the forefront of bringing advanced healthcare solutions to market, making a tangible difference in peoples lives worldwide.This position will be office-based in Bellaterra.

Test Strategy & Equipment Setup: Define and deploy the test infrastructure required to characterize 3D MEMS process steps thermal bonding, wafer-level packaging, TGV, electrochemical or mechanical reliability testing. Specify, qualify and operate metrology, electrical test, and reliability equipment.Process Characterization & DOEs: Design and execute structured experiments to characterize 3D MEMS unit processes and integrated flows. Generate the data needed to set process windows, control limits, and acceptance criteria across coupled process steps.

Data Analysis & Industrialization: Build Python-based data pipelines to analyze high-volume process and test data. Translate findings directly into process and test recipe improvements.

Hardware & Electrical Characterization: Lead electrical and physical characterization across 3D MEMS structures. Use SMUs, DAQs, oscilloscopes, probe stations, and dedicated MEMS test rigs to measure critical parameters at the required precision.

Materials & Failure Analysis: Apply materials science fluency, thin films, interfaces, integration physics, to root-cause analysis on failures across, bonding, packaging, TGV interfaces and electromechanical reliability. Work directly with Process Integration, Packaging, Hardware, mechanical and Software teams to align test requirements, hardware specifications, and data infrastructure.



Translate 3D MEMS physics into testable specifications across disciplines.

Take prototype test setups out of R&D; and harden them for pilot and production. Author SOPs, qualify equipment (IQ / OQ / PQ), and integrate with MES where applicable. Identify opportunities to reduce variation, improve test throughput, and tighten the link between process control and electrical / yield outcomes across the 3D MEMS stack.Bachelor’s or Master’s degree in Electrical Engineering, Applied Physics, Materials Science, Microelectronics, or a related field. 5+ years in Test Development, Device Characterization, or Yield Engineering within a semiconductor, MEMS, or advanced packaging environment.

Vertical Integration & MEMS Expertise: Hands-on experience with testing and characterizing advanced packaging architectures, including wafer-level thermal bonding, Through-Glass Vias (TGV) / TSV metallization, and electromechanical reliability.

Data Science & Scripting: High proficiency in Python (e.g., Pandas, NumPy, SciPy) for complex data analysis, instrument control (SCPI/VISA), and automating high-volume, lot-level data workflows.Test Equipment & Instrumentation: Hands-on expertise building test setups with SMUs, DAQs, oscilloscopes, and automated metrology tools. Deep understanding of semiconductor/MEMS device physics, thin films, and electromechanical integration. CTE mismatch, delamination, voiding) to design accurate test traps.

Industrialization Track Record: Proven ability to take prototype test platforms out of R&D; and industrialize them for pilot or production use, including authoring SOPs and executing equipment qualification (IQ/OQ/PQ).



Takes full ownership of test strategy, equipment readiness, and data quality. Nice to have (optional):Database Architecture: Experience interfacing automated test hardware with Manufacturing Execution Systems (MES) or SQL databases, and building visual dashboards (e.g., Grafana, PowerBI) for tracking yield and Cpk.Reliability & Environmental Testing: Practical knowledge of accelerated aging models, hermeticity testing (leak rate analysis), and Electrochemical Impedance Spectroscopy (EIS).Neurotechnology & Mixed-Signal Electronics: Familiarity with high-channel-count analog front-ends (AFEs), custom ASICs, or complex neural electrophysiology signal chains.Statistical Process Control: Working knowledge of PFMEA, DOE methodology, SPC, and Cpk-driven process control in regulated manufacturing environments.Meaningful Work Impact: Our projects are not only exciting and challenging but also have a positive impact on the industry and society as a whole.

Competitive salary (according to your experience/skills) Internal versátil compensation schemePrivate Health Insurance Training bonus for professional development and access to Udemy platform23 vacation days per yearChristmas week offWhile we offer flexible working modality, because of the nature of this position, this will be an office-based position in Bellaterra.Our mission is to transform the treatment of neurological disorders through neuroelectronic therapies that are safer, smarter, and more human‑centered. We work at the intersection of neuroscience, engineering, and advanced materials, but what truly drives us is the impact our work can have on patients’ lives.We encourage everyone to think like Game Changers, challenging assumptions and pushing boundaries to unlock breakthroughs that once felt out of reach.We act with Conscious Impact, aware that every decision—from research to clinical translation—shapes real futures.

📌 Senior Advanced Packaging Engineer (Barcelona)
🏢 Inbrain Neuroelectronics
📍 Barcelona