OverviewCualquier información adicional que necesite para este trabajo se encuentra en el texto a continuación. Asegúrese de leerla detenidamente y luego envíe su solicitud.Director, Field Applications Engineering (UK/EU/APAC)Role Overview:Lead and grow a world-class Field Applications Engineering (FAE) team across Europe and the Asia-Pacific region. You will drive the technical adoption, integration, and design-win pipeline for our next-generation fabric interconnect silicon IP. You will be responsible for both Pre AND Post sales support.Role DetailsPosition: Senior Manager, Field Applications EngineeringLocation: Remote (Based in the EU or the UK)Region Coverage: UK, Europe (EU) and Asia-Pacific (APAC)Travel: Up to 30-40% international travel requiredKey ResponsibilitiesManage: Lead a distributed team of senior FAEs across EU and APAC.Hire: Recruit and onboard top-tier engineering talent in key regional hubs.Coach: Provide continuous technical mentorship and professional development.Align: Set clear regional goals aligned with corporate business objectives.Grow collaterals, to enable improved efficiency / ease of adoption by the customerTechnical Account Management & Sales SupportDrive Strategy: Partner with regional sales directors to secure high-value design wins.Own Delivery: Act as the escalations point for critical customer technical issues.Guide Evaluation: Oversee customer proof-of-concepts, evaluations, and architectural reviews.Present: Deliver technical keynotes, deep-dives, and product demonstrations to C-level executives.Feedback Loop:



Funnel regional customer requirements directly to internal R&D; and Product Management.Influence Roadmap: Use market insights to shape the future fabric interconnect IP roadmap.Enablement: Create application notes, whitepapers, and training collateral for regional ecosystems.Required QualificationsExperience & EducationEducation: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field.Management: 5+ years of experience managing customer-facing engineering teams (FAE or Technical Support).Industry: 10+ years in the semiconductor, silicon IP, or high-performance networking sectors.Technical ExpertiseIP Knowledge: Deep understanding of Network-on-Chip (NoC), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics.Design Flow: Familiarity with front-end ASIC design, SoC architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens).Systems: Insight into AI/ML accelerators, data center architectures, and automotive SoC requirements.Soft Skills & LogisticsCommunication: Exceptional English verbal and written communication skills.Cross-Cultural: Proven experience managing teams and clients across diverse cultures in Europe and Asia.Autonomy: Self-motivated style suited for a fast-paced, early-stage startup environment.Preferred QualificationsMaster’s degree or PhD in Electrical or Computer Engineering.Prior experience working in a fast-growing, venture-backed silicon IP startup.Existing technical relationships with major Tier-1 semiconductor and system companies in the EU and APAC. xqbhyrx Additional language skills relevant to the covered regions (e.g., Mandarin, Japanese, Korean, German).#J-18808-Ljbffr

📌 Director of Field Applications Engineers; EU, UK, APAC (Madrid)
🏢 Talent
📍 Madrid