Overview
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Director, Field Applications Engineering (UK/EU/APAC)
Role Overview:
Lead and grow a world-class Field Applications Engineering (FAE) team across Europe and the Asia-Pacific region. You will drive the technical adoption, integration, and design-win pipeline for our next-generation fabric interconnect silicon IP. You will be responsible for both Pre AND Post sales support.
Role Details
Position: Senior Manager, Field Applications Engineering
Location: Remote (Based in the EU or the UK)
Region Coverage: UK, Europe (EU) and Asia-Pacific (APAC)
Travel: Up to 30-40% international travel required
Key Responsibilities
Manage: Lead a distributed team of senior FAEs across EU and APAC.
Hire: Recruit and onboard top-tier engineering talent in key regional hubs.
Coach: Provide continuous technical mentorship and professional development.
Align: Set clear regional goals aligned with corporate business objectives.
Grow collaterals, to enable improved efficiency / ease of adoption by the customer
Technical Account Management & Sales Support
Drive Strategy: Partner with regional sales directors to secure high-value design wins.
Own Delivery: Act as the escalations point for critical customer technical issues.
Guide Evaluation: Oversee customer proof-of-concepts, evaluations, and architectural reviews.
Present: Deliver technical keynotes, deep-dives, and product demonstrations to C-level executives.
Feedback Loop:



Funnel regional customer requirements directly to internal R&D; and Product Management.
Influence Roadmap: Use market insights to shape the future fabric interconnect IP roadmap.
Enablement: Create application notes, whitepapers, and training collateral for regional ecosystems.
Required Qualifications
Experience & Education
Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field.
Management: 5+ years of experience managing customer-facing engineering teams (FAE or Technical Support).
Industry: 10+ years in the semiconductor, silicon IP, or high-performance networking sectors.
Technical Expertise
IP Knowledge: Deep understanding of Network-on-Chip (NoC), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics.
Design Flow: Familiarity with front-end ASIC design, SoC architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens).
Systems: Insight into AI/ML accelerators, data center architectures, and automotive SoC requirements.
Soft Skills & Logistics
Communication: Exceptional English verbal and written communication skills.
Cross-Cultural: Proven experience managing teams and clients across diverse cultures in Europe and Asia.
Autonomy: Self-motivated style suited for a fast-paced, early-stage startup environment.
Preferred Qualifications
Master’s degree or PhD in Electrical or Computer Engineering.
Prior experience working in a fast-growing, venture-backed silicon IP startup.
Existing technical relationships with major Tier-1 semiconductor and system companies in the EU and APAC. xqbhyrx
Additional language skills relevant to the covered regions (e.g., Mandarin, Japanese, Korean, German).
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📌 Director of Field Applications Engineers; EU, UK, APAC (Madrid)
🏢 Baya Systems
📍 Madrid