We are scientists, doctors, techies and humanity lovers, with the mission of building neuroelectronic interfaces to cure brain disorders. INBRAIN harnesses the extraordinary material properties of Graphene, the world’s thinnest and nobel-prize winning material, to build safe, uninvasive and highly efficient neural solutions. Our mission is to decode and modulate neural networks to improve people's lives.

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As a Senior Advanced Packaging Engineer, you will be the technical architect of metrology, electrical test and data analysis infrastructure. The primary goal is to invent, build and operate the automated test systems required to characterize complex vertical integration processes (advanced packaging, TGV, electromechanical reliability).

You will be at the forefront of bringing advanced healthcare solutions to market, making a tangible difference in people´s lives worldwide.



This position will be office-based in Bellaterra.

Main responsibilities

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- Test Strategy & Equipment Setup: Define and deploy the test infrastructure required to characterize 3D MEMS process steps thermal bonding, wafer‑level packaging, TGV, electrochemical or mechanical reliability testing. Specify, qualify and operate metrology, electrical test, and reliability equipment.
- Process Characterization & DOEs: Design and execute structured experiments to characterize 3D MEMS unit processes and integrated flows. Generate the data needed to set process windows, control limits, and acceptance criteria across coupled process steps.
- Data Analysis & Industrialization: Build Python‑based data pipelines to analyze high‑volume process and test data. Extract yield, Cpk, drift, and failure‑mode signatures. Translate findings directly into process and test recipe improvements.
- Hardware & Electrical Characterization: Lead elec

📌 Senior Advanced Packaging Engineer (Barcelona)
🏢 Inbrain Neuroelectronics
📍 Barcelona