Overview

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Director, Field Applications Engineering (UK/EU/APAC)

Role Overview

Lead and grow a world-class Field Applications Engineering (FAE) team across Europe and the Asia-Pacific region. You will drive the technical adoption, integration, and design-win pipeline for our next-generation fabric interconnect silicon IP. You will be responsible for both Pre AND Post sales support.

Role Details

- Position: Senior Manager, Field Applications Engineering
- Location: Remote (Based in the EU or the UK)
- Region Coverage: UK, Europe (EU) and Asia-Pacific (APAC)
- Travel: Up to 30-40% international travel required

Key Responsibilities
- Manage: Lead a distributed team of senior FAEs across EU and APAC.
- Hire: Recruit and onboard top-tier engineering talent in key regional hubs.
- Coach: Provide continuous technical mentorship and professional development.
- Align: Set clear regional goals aligned with corporate business objectives.
- Grow collaterals, to enable improved efficiency / ease of adoption by the customer

Technical Account Management & Sales Support
- Drive Strategy: Partner with regional sales directors to secure high-value design wins.
- Own Delivery: Act as the escalations point for critical customer technical issues.
- Guide Evaluation: Oversee customer proof-of-concepts, evaluations, and architectural reviews.
- Present: Deliver technical keynotes, deep-dives, and product demonstrations to C-level executives.
- Feedback Loop: Funnel regional customer requirements directly to internal R&D; and Product Management.




- Influence Roadmap: Use market insights to shape the future fabric interconnect IP roadmap.
- Enablement: Create application notes, whitepapers, and training collateral for regional ecosystems.

Required Qualifications Experience & Education
- Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field.
- Management: 5+ years of experience managing customer-facing engineering teams (FAE or Technical Support).
- Industry: 10+ years in the semiconductor, silicon IP, or high-performance networking sectors.

Technical Expertise
- IP Knowledge: Deep understanding of Network-on-Chip (NoC), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics.
- Design Flow: Familiarity with front-end ASIC design, SoC architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens).
- Systems: Insight into AI/ML accelerators, data center architectures, and automotive SoC requirements.

Soft Skills & Logistics
- Communication: Exceptional English verbal and written communication skills.
- Cross-Cultural: Proven experience managing teams and clients across diverse cultures in Europe and Asia.
- Autonomy: Self-motivated style suited for a fast-paced, early-stage startup environment.

Preferred Qualifications
- Master’s degree or PhD in Electrical or Computer Engineering.
- Prior experience working in a fast-growing, venture-backed silicon IP startup.
- Existing technical relationships with major Tier-1 semiconductor and system companies in the EU and APAC. xugodme
- Additional language skills relevant to the covered regions (e.G., Mandarin, Japanese, Korean, German).

📌 Director Of Field Applications Engineers; Eu, Uk, Apac (España)
🏢 Baya Systems
📍 España