05 ago
|
Inbrain Neuroelectronics
|
Barcelona
05 ago
Inbrain Neuroelectronics
Barcelona
INBRAIN Neuroelectronics seeks a Senior Advanced Packaging Engineer to architect metrology, electrical test and data analysis infrastructure for 3D MEMS processes.
Si desea conocer los requisitos para este puesto, siga leyendo para obtener toda la información relevante.
You will design and run DOE studies, build data pipelines and lead electrical/physical characterization using SMUs, DAQs, scopes, and MEMS test rigs.
You will drive process understanding and industrialize prototype test platforms xqbhyrx for pilot and production, coordinating across Packaging, Hardware, and Software teams in a fast-moving
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📌 Senior MEMS Packaging & Test Architect (Barcelona)
🏢 Inbrain Neuroelectronics
📍 Barcelona