04 ago
|
Inbrain Neuroelectronics
|
Barcelona
04 ago
Inbrain Neuroelectronics
Barcelona
pINBRAIN Neuroelectronics seeks a Senior Advanced Packaging Engineer to architect metrology, electrical test and data analysis infrastructure for 3D MEMS processes. You will design and run DOE studies, build data pipelines and lead electrical/physical characterization using SMUs, DAQs, scopes, and MEMS test rigs. /ppYou will drive process understanding and industrialize prototype test platforms for pilot and production, coordinating across Packaging, Hardware, and Software teams in a fast-moving /p #J-18808-Ljbffr
📌 Senior MEMS Packaging & Test Architect (Barcelona)
🏢 Inbrain Neuroelectronics
📍 Barcelona