ph3Overview /h3pDirector, Field Applications Engineering (UK/EU/APAC) /ppRole Overview: /ppLead and grow a world-class Field Applications Engineering (FAE) team across Europe and the Asia-Pacific region. You will drive the technical adoption, integration, and design-win pipeline for our next-generation fabric interconnect silicon IP. You will be responsible for both Pre AND Post sales support. /ph3Role Details /h3ulliPosition: Senior Manager, Field Applications Engineering /liliLocation: Remote (Based in the EU or the UK) /liliRegion Coverage: UK, Europe (EU) and Asia-Pacific (APAC) /liliTravel: Up to 30-40% international travel required /li /ulh3Key Responsibilities /h3ulliManage: Lead a distributed team of senior FAEs across EU and APAC. /liliHire: Recruit and onboard top-tier engineering talent in key regional hubs. /liliCoach: Provide continuous technical mentorship and professional development. /liliAlign: Set clear regional goals aligned with corporate business objectives. /liliGrow collaterals, to enable improved efficiency / ease of adoption by the customer /li /ulh3Technical Account Management Sales Support /h3ulliDrive Strategy: Partner with regional sales directors to secure high-value design wins. /liliOwn Delivery: Act as the escalations point for critical customer technical issues. /liliGuide Evaluation: Oversee customer proof-of-concepts, evaluations, and architectural reviews. /liliPresent: Deliver technical keynotes, deep-dives, and product demonstrations to C-level executives. /liliFeedback Loop: Funnel regional customer requirements directly to internal RD and Product Management. /liliInfluence Roadmap:



Use market insights to shape the future fabric interconnect IP roadmap. /liliEnablement: Create application notes, whitepapers, and training collateral for regional ecosystems. /li /ulh3Required Qualifications /h3pExperience Education /pulliEducation: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field. /liliManagement: 5+ years of experience managing customer-facing engineering teams (FAE or Technical Support). /liliIndustry: 10+ years in the semiconductor, silicon IP, or high-performance networking sectors. /li /ulh3Technical Expertise /h3ulliIP Knowledge: Deep understanding of Network-on-Chip (NoC), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics. /liliDesign Flow: Familiarity with front-end ASIC design, SoC architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens). /liliSystems: Insight into AI/ML accelerators, data center architectures, and automotive SoC requirements. /li /ulh3Soft Skills Logistics /h3ulliCommunication: Exceptional English verbal and written communication skills. /liliCross-Cultural: Proven experience managing teams and clients across diverse cultures in Europe and Asia. /liliAutonomy: Self-motivated style suited for a fast-paced, early-stage startup environment. /li /ulh3Preferred Qualifications /h3ulliMaster’s degree or PhD in Electrical or Computer Engineering. /liliPrior experience working in a fast-growing, venture-backed silicon IP startup. /liliExisting technical relationships with major Tier-1 semiconductor and system companies in the EU and APAC. /liliAdditional language skills relevant to the covered regions (e.g., Mandarin, Japanese, Korean, German). /li /ul /p #J-18808-Ljbffr

📌 Director of Field Applications Engineers; EU, UK, APAC (España)
🏢 Baya Systems
📍 España