ID: PD-1

Description

We are hiring! Are you passionate about physical chip design and ing teams through complex challenges? We need you! As a Physical Implementation Lead, you will take ownership of the entire physical implementation process, from physical chip design to chip production and post-silicon validation. You will work with cutting-edge technology, collaborating closely with external IP providers, EDA vendors, and silicon/package vendors to deliver high-performance SoCs or SiPs for mass production.

You will ensure efficient synchronization between the chip, package, and PCB design teams to meet product goals and timelines while keeping product managers informed through detailed reporting. In addition, you will participate in technical hands-on work when needed and moderate operational design discussions to make swift and efficient decisions.

What do we offer? Adaptable work schedules, competitive pay, a highly collaborative learning environment, and opportunities for career growth. Come and join us in the beautiful city of Barcelona! Candies, coffee, and free Spanish lessons included! (Visa sponsorship available if required.)

Key Responsibilities

- Lead the physical implementation process of high-complexity SoCs using advanced technology nodes.




- Collaborate with external IP providers, EDA vendors, and silicon/package vendors for smooth data exchange and communication.
- Coordinate synchronization between chip design, package design, and PCB design teams.
- Ensure compliance with product goals and timelines through efficient project management and reporting.
- Actively participate in team meetings to provide technical guidance on physical design flow, design for test, and EDA tools and methods.
- Moderate design discussions and make decisions quickly and effectively.
- Occasionally perform technical hands-on tasks to support the team as required.

Requirements

- Master’s or PhD degree in Computer Science, Microelectronics, or Physics.
- Proven experience with multiple tapeouts of high-performance SoCs or SiPs for mass production, including reliability and yield optimization.
- Demonstrated ability to manage complex SoC or SiP projects as a functional manager.
- Strong background in high-speed digital design.
- Excellent presentation and conflict management skills.
- Experience with multi-chiplet design is a significant advantage.

If you are ready to take on a ership role in one of the most exciting fields of chip design, apply now!

LEAD

📌 Physical Design Lead (España)
🏢 Semidynamics
📍 España