INBRAIN Neuroelectronics seeks a Senior Advanced Packaging Engineer to architect metrology, electrical test and data analysis infrastructure for 3D MEMS processes. You will design and run DOE studies, build data pipelines and lead electrical/physical characterization using SMUs, DAQs, scopes, and MEMS test rigs.You will drive process understanding and industrialize prototype test platforms for pilot and production, coordinating across Packaging, Hardware, and Software teams in a fast-moving#J-18808-Ljbffr