Job SummaryJoin Qorvo’s Packaging Modeling Team as a Packaging Engineer focused on advancing simulation methodologies for our diverse product catalog. This onsite role, based in Barcelona, Spain, involves working five days a week in the office.ResponsibilitiesConduct thermal, mechanical, and thermo‑mechanical FEA simulations for various Qorvo devices and package typesDevelop and refine simulation methodologies to enhance speed and accuracySupport business units with mechanical engineering expertiseIdentify potential quality risks and propose effective solutionsOptimize model size, detail, and generation processes to reduce simulation cycle timesCollaborate with cross‑functional teams across Qorvo to drive technology improvementsRequired QualificationsPh.D. in Physics, Mechanical/Electrical Engineering, Material Science, or related fieldStrong understanding of thermal physics and processesExperience with FEA/FEM simulation toolsExcellent presentation and communication skillsProven ability to work effectively in a integral,



collaborative environmentProficiency in packaging and semiconductor technologiesPreferred QualificationsExperience in packaging engineering, mechanical or materials engineering, reliability engineering, or a related technical field, with a focus on simulation, modeling, or process optimizationHands‑on experience with Ansys MechanicalBasic knowledge of RF circuit designEligibilityThis position is open only to candidates having a qualified legal status to work in Spain.Equal Employment OpportunityWe are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.#J-18808-Ljbffr

📌 Engineering Category Packaging (Madrid)
🏢 Inbrain Neuroelectronics
📍 Madrid