Overview

Director, Field Applications Engineering (UK/EU/APAC) Role Overview: Lead and grow a world-class Field Applications Engineering (FAE) team across Europe and the Asia-Pacific region. You will drive the technical adoption, integration, and design-win pipeline for our next-generation fabric interconnect silicon IP. You will be responsible for both Pre AND Post sales support. Role Details

Position: Senior Manager, Field Applications Engineering Location: Remote (Based in the EU or the UK) Region Coverage: UK, Europe (EU) and Asia-Pacific (APAC) Travel: Up to 30-40% international travel required Key Responsibilities

Manage: Lead a distributed team of senior FAEs across EU and APAC. Hire: Recruit and onboard top-tier engineering talent in key regional hubs. Coach: Provide continuous technical mentorship and professional development. Align: Set clear regional goals aligned with corporate business objectives. Grow collaterals, to enable improved efficiency / ease of adoption by the customer Technical Account Management & Sales Support

Drive Strategy: Partner with regional sales directors to secure high-value design wins.

Own Delivery: Act as the escalations point for critical customer technical issues.

Guide Evaluation: Oversee customer proof-of-concepts, evaluations, and architectural reviews.

Present: Deliver technical keynotes, deep-dives, and product demonstrations to C-level executives.

Feedback Loop: Funnel regional customer requirements directly to internal R&D; and Product Management.

Influence Roadmap:



Use market insights to shape the future fabric interconnect IP roadmap.

Enablement: Create application notes, whitepapers, and training collateral for regional ecosystems.

Required

Qualifications

Experience & Education Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field. Management: 5+ years of experience managing customer-facing engineering teams (FAE or Technical Support). Industry: 10+ years in the semiconductor, silicon IP, or high-performance networking sectors. Technical Expertise

IP Knowledge: Deep understanding of Network-on-Chip (NoC), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics. Design Flow: Familiarity with front-end ASIC design, SoC architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens). Systems: Insight into AI/ML accelerators, data center architectures, and automotive SoC requirements. Soft Skills & Logistics

Communication: Exceptional English verbal and written communication skills. Cross-Cultural: Proven experience managing teams and clients across diverse cultures in Europe and Asia. Autonomy: Self-motivated style suited for a fast-paced, early-stage startup environment. Preferred Qualifications

Master’s degree or PhD in Electrical or Computer Engineering. Prior experience working in a fast-growing, venture-backed silicon IP startup. Existing technical relationships with major Tier-1 semiconductor and system companies in the EU and APAC. Additional language skills relevant to the covered regions (e.g., Mandarin, Japanese, Korean, German).

📌 Director of Field Applications Engineers; EU, UK, APAC (Madrid)
🏢 Baya Systems
📍 Madrid