30 jul
|
Inbrain Neuroelectronics
|
Barcelona
30 jul
Inbrain Neuroelectronics
Barcelona
INBRAIN NEUROELECTRONICS in Bellaterra is seeking a Senior Advanced Packaging Engineer to architect metrology, electrical test, and data-analysis infrastructure for 3D MEMS processes. You will deploy test systems, run DOEs, and translate results into process improvements. You will lead electrical/physical characterization across MEMS structures, build Python data pipelines, and collaborate across R&D;, Packaging, Hardware, and Software to scale prototypes to production.
📌 Senior MEMS Packaging Test Architect (Barcelona)
🏢 Inbrain Neuroelectronics
📍 Barcelona