Team Lead - Mechanical Engineer General Overview Functional Area:

Engineering Career Stream

Design Engineering Mechanical SAP Short Name:

LEN-ENG-DME Job Level:

Level 08 IC/MGR

Individual Contributor Direct/Indirect Indicator:

Indirect

Summary We are looking for a Senior Engineer with leadership capabilities to manage the mechanical development of complex ruggedized electronic systems (Control Units, Power, and Computing modules). The idóneo candidate will lead the engineering team in Spain, acting as the focal point for design decisions, and will coordinate technical integration with our international engineering teams.

Responsibilities

Lead, mentor, and prioritize tasks for the local engineering team (2 engineers).

Act as the primary technical interface with the Thailand-based team (responsible for complementary subsystems) to ensure seamless mechanical and system integration.

Collaborate closely with the System Engineer and Project Manager to align design progress with project milestones.

Manage and maintain the System BOM (Bill of Materials), ensuring accuracy and traceability.

Analyze customer specifications and System Requirements to define mechanical constraints (thermal, structural). Translate these high-level requirements into actionable tasks for the engineering team.

Maintain the Requirements Compliance Matrix (VCRM), ensuring every design decision (materials, coatings, fasteners) aligns with the technical specs and MIL-STD-810 standards.

Supervise the mechanical design of VPX 3U based systems, ensuring structural integrity and IP65 sealing (watertight/dust-tight) for harsh environments.

Lead the design of high-efficiency thermal solutions (conduction cooling) for high-power density electronics. This may include the use of heat pipes, heat spreaders,



cold plates, etc.

Oversee the integration of the Backplane and the IO Panel (circular connectors), defining the interconnection strategy (cabling to payloads or rigid-flex PCB to backplane).

Supervise prototype assembly and integration.

Define and oversee verification plans according to MIL-STD-810 / DO-160 standards (vibration, shock, temperature, etc.).

Qualifications

Bachelor’s degree in Mechanical Engineering, Aerospace, or related field.

5+ years of experience in mechanical design for electronics packaging, with proven experience leading technical teams or managing work packages.

Expert knowledge of SolidWorks and SolidWorks Simulation (thermal & structural analysis). Jira or JAMA is recommended.

Deep understanding of thermal management in sealed enclosures (conduction cooling).

Experience designing for IP65 environments.

Fluent English is mandatory for daily communication with international teams.

Nice to have

Previous experience in the Defense or Aerospace sector is a strong plus.

Experience with VPX or similar modular architectures.

Familiarity with military standards (MIL-STD-810, DO-160) and VITA specifications.

Knowledge of manufacturing processes (CNC machining) and surface treatments/finishes suitable.

Equal Opportunity Celestica is an equal opportunity employer. All qualified applicants will receive consideration for employment and will not be discriminated against on any protected status (including race, religion, national origin, gender, sexual orientation, age, marital status, veteran or disability status or other characteristics protected by law).

Celestica is committed to fostering an inclusive, accessible environment. Special arrangements can be made for candidates who need them throughout the hiring process.

📌 Team Lead - Mechanical Engineer (Madrid)
🏢 Celestica
📍 Madrid